DOC KB-EMI-018REV 2026-09-21CLASS: PUBLIC

EMI and RFI Shielding Cases: When Plastic Is Not Enough

Direct answer

A standard plastic protective case provides no meaningful EMI/RFI shielding. When electronics must be shielded in transit or in use, the three established paths are: aluminum case construction (excellent inherent conductivity), plastic shells with conductive coatings (vacuum-metallized or conductive-paint interiors), and EMI gasketing — conductive elastomer seals that close the lid gap electrically. Shielding performance is set by the weakest path: an unsealed plastic lid gap defeats an aluminum body.

§01The three approaches

ApproachTypical attenuationStrengthsWatch out for
Aluminum casevery high, broadbandalso fire/heat tolerant; durable threadsweight, denting, cost
Metallized / conductive-coated plasticmoderate, frequency-dependentkeeps weight and corrosion resistance of plasticcoating wear at latch/hinge points
EMI gaskets on any shell— (completes the enclosure)closes seams and lid linesmust be inspected; takes compression set like any elastomer

§02Engineering notes

Reality check: many buyers specify "EMI case" when they actually need ESD-safe packaging. Shielding blocks external RF in/out; ESD protection prevents static discharge to components. If the threat is a charged operator touching a PCB, anti-static foam and packaging discipline solve it at a fraction of the cost.

REF KB-EMI-018 · Published 2026-09-21 · Reviewed by the KeXin Materials engineering team · Sources: IEC 60529; ISO 6346; ATA 300; MIL-STD-810; Incoterms® 2020